International Microelectronics Assembly & Packaging Society



The forces behind the International Conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect & Ceramic Microsystems Technologies (CICMT), and Thermal and Power Solutions have joined for a special crossover technology extravaganza.


Submissions accepted from 12:00 EST on 01/01/2020 to 11:59pm EST on 03/06/2020