International Microelectronics Assembly & Packaging Society



The forces behind the International Conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect & Ceramic Microsystems Technologies (CICMT), and Power Packaging have joined for a special crossover technology extravaganza.


HiTEC/CICMT/Power Packaging 2021 is now a VIRTUAL CONFERENCE!
IMAPS consulted government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of the 2021 Conference. We have determined that the in-person components of the events are unsafe or not possible to conduct in our customary manners and formats due to the pandemic. 
Submissions accepted from 12:00am EST on 01/01/2020 to 11:59pm EST on 03/19/2021