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International Microelectronics Assembly & Packaging Society
+1(919)293-5000
info@imaps.org
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About Us
About Us
Educational Foundation
Bylaws
Contact Us
Executive Council
Membership
About Membership
Join/Renew
IMAPS Chapters
Society Awards
IMAPS 2020 Society Award Winners
Jobs
Global Business Council (GBC)
Student Membership and Opportunities
Events
Events
Events Calendar
Submit your Abstract
Propose a PDC
Speaker/Chair Information
Virtual Events
International Symposium on Microelectronics
Device Packaging Conference
Technology Crossover | HiTEC, CICMT, APEPS
Live Virtual Workshop on Wire Bonding
Advanced System-in-Package (SiP) Conference
Publications
Publications Information
Visit IMAPSource Research Portal
Advertising Opportunities
Journal Copyright Transfer Form
Advancing Microelectronics Magazine
Videos
Videos
Value of Membership
IMAPS for Students
Corporate Connections
News
Recent News
Subscribe to IMAPS Emails
Member Log In
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International Microelectronics Assembly & Packaging Society
Technology Crossover 2021 - HiTEC, CICMT, Power Packaging
The forces behind the International Conferences on
High Temperature Electronics (HiTEC), Ceramic Interconnect & Ceramic Microsystems Technologies (CICMT)
, and
Power Packaging
have joined for a special crossover technology extravaganza.
HiTEC/CICMT/Power Packaging 2021 is now a VIRTUAL CONFERENCE!
IMAPS consulted government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of the 2021 Conference. We have determined that the in-person components of the events are unsafe or not possible to conduct in our customary manners and formats due to the pandemic.