Event Registration - International Microelectronics Assembly & Packaging Society

International Conference on Device Packaging 2023
3/13/2023 - 3/16/20238:00 AM - 12:00 PM PST
Location: WE-KO-PA RESORT & CONFERENCE CENTER, 10438 WEKOPA WAY, FORT MCDOWELL, AZ 85264
Event Description
19th International Conference and Exhibition on
DEVICE PACKAGING
We-Ko-Pa Resort and Conference Center
Fountain Hills, Arizona USA
March 13-16, 2023
The largest 2023 conference dedicated to:
Heterogeneous 2D & 3D Integration
Fan-Out, Wafer Level Packaging & Flip Chip
Automotive, 5G/6G, Photonics, HiSpeed RF
♦ Visit www.imaps.org/devicepackaging for full event details. ♦