19th International Conference and Exhibition on
DEVICE PACKAGING

We-Ko-Pa Resort and Conference Center
Fountain Hills, Arizona USA
March 13-16, 2023

The largest 2023 conference dedicated to:

Heterogeneous 2D & 3D Integration 
Fan-Out, Wafer Level Packaging & Flip Chip
Automotive, 5G/6G, Photonics, HiSpeed RF


♦ Visit www.imaps.org/devicepackaging for full event details. ♦