Event Registration - International Microelectronics Assembly & Packaging Society
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International Conference on Device Packaging 2023
3/13/2023 - 3/16/2023
8:00 AM - 12:00 PM PST

Event Description

19th International Conference and Exhibition on

We-Ko-Pa Resort and Conference Center
Fountain Hills, Arizona USA
March 13-16, 2023

The largest 2023 conference dedicated to:

Heterogeneous 2D & 3D Integration 
Fan-Out, Wafer Level Packaging & Flip Chip
Automotive, 5G/6G, Photonics, HiSpeed RF

♦ Visit www.imaps.org/devicepackaging for full event details. ♦