Event Registration - International Microelectronics Assembly & Packaging Society
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2023 Topical Workshop and Tabletop Exhibition on Wire Bonding
2/2/2023 - 2/3/2023
8:00 AM - 4:00 PM PST

Event Description

Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and marketing people from around the world who have been working in the area of Wire Bonding.  This workshop has been specifically organized to allow for the presentation and debate of some of the latest technologies out there related to the use of Wire Bonding in battery pack, semiconductor and microelectronic packaging.