3/7/2022 - 3/10/2022

18th International Conference and Exhibition on
DEVICE PACKAGING

We-Ko-Pa Resort and Conference Center
Fountain Hills, Arizona USA
March 7-10, 2022


The largest 2022 conference dedicated to:

Heterogeneous 2D & 3D Integration 
Fan-Out, Wafer Level Packaging & Flip Chip
Automotive, 5G, and Next Gen Applications


♦ Visit www.imaps.org/devicepackaging for full event details. ♦

Location: WE-KO-PA RESORT & CONFERENCE CENTER, 10438 WEKOPA WAY, FORT MCDOWELL, AZ , AZ 85264