Event Registration - International Microelectronics Assembly & Packaging Society
International Conference on Device Packaging 2022
3/7/2022 - 3/10/2022Event Description
18th International Conference and Exhibition on
DEVICE PACKAGING
We-Ko-Pa Resort and Conference Center
Fountain Hills, Arizona USA
March 7-10, 2022
The largest 2022 conference dedicated to:
Heterogeneous 2D & 3D Integration
Fan-Out, Wafer Level Packaging & Flip Chip
Automotive, 5G, and Next Gen Applications
♦ Visit www.imaps.org/devicepackaging for full event details. ♦