Event Registration - International Microelectronics Assembly & Packaging Society
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International Conference on Device Packaging 2022
3/7/2022 - 3/10/2022

Event Description

18th International Conference and Exhibition on

We-Ko-Pa Resort and Conference Center
Fountain Hills, Arizona USA
March 7-10, 2022

The largest 2022 conference dedicated to:

Heterogeneous 2D & 3D Integration 
Fan-Out, Wafer Level Packaging & Flip Chip
Automotive, 5G, and Next Gen Applications

♦ Visit www.imaps.org/devicepackaging for full event details. ♦