18th International Conference and Exhibition on
DEVICE PACKAGING

We-Ko-Pa Resort and Conference Center
Fountain Hills, Arizona USA
March 7-10, 2022


The largest 2022 conference dedicated to:

Heterogeneous 2D & 3D Integration 
Fan-Out, Wafer Level Packaging & Flip Chip
Automotive, 5G, and Next Gen Applications


♦ Visit www.imaps.org/devicepackaging for full event details. ♦