Event Registration - International Microelectronics Assembly & Packaging Society
Virtual Crossover Technology Extravaganza - HiTEC, CICMT, Power Pkg 2021
4/26/2021 - 4/29/2021
7:00 AM - 2:00 PM

Technology Crossover Extravaganza
April 26-29, 2021
An Online Event


Three International Conferences in One Place
High Temperature Electronics Conference (HiTEC)
Ceramic Interconnect and Ceramic Microsystem Technologies Conference (CICMT)
Advanced Power Electronics Packaging Symposium (APEPS)

One online event| One registration | Three times the content, networking, and education!

Three star IMAPS conferences align virtually in 2021 for an incredible attendee experience. The forces behind the International Conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect & Ceramic Microsystems Technologies (CICMT), and Advanced Power Electronics Packaging Symposium (APEPS) have joined for a special crossover technology extravaganza. These three major events will be hosted simultaneously from April 26-29th.


Location: A Global Virtual Event