Event Registration - International Microelectronics Assembly & Packaging Society
IMAPS Virtual Workshop on Wire Bonding

Overview:  The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Virtual Workshop on WIRE BONDING on May 5, 2021, using the Microsoft Teams Live Event software. The objective of the Wire Bonding Virtual Workshop is to have a unique forum that brings together scientists, engineers, manufacturing and academia people from around the world who have been working in the area of Wire Bonding.  This workshop has been specifically organized to allow for the presentation and debate of some of the latest technologies related to the use of Wire Bonding in semiconductor and microelectronic packaging. Abstracts will be considered for the following topics:
•           Wire bonding and bumping
•           Novel packaging and design
•           Failure Analysis and Reliability
•           Simulation and Modeling

This virtual workshop will be hosted via MS Teams. Registrants will receive an email prior to the start of the webinar with login instructions. 
Location: MS Teams Online Platform