Event Registration - International Microelectronics Assembly & Packaging Society
Live Technical Webinar Series Oct 28: Advanced High Density Rigid Packaging Substrates for RF and Miniaturization
10/28/2020
12:00 PM - 12:45 PM

This registration is for the October 28th Live Technical Webinar on Advanced High Density Rigid Packaging Substrates for RF and Miniaturization presented by Daniel Schulze of DYCONEX AG.

Click here to view the program and webinar details.

Registration is FREE for IMAPS members and $50 for non-members. Registrants will receive the webinar login credentials on October 28th, prior to the start of the webinar.
Location: Online Webinar