Event Registration - International Microelectronics Assembly & Packaging Society
Live Technical Webinar Series: July 157/15/2020
12:00 PM - 12:45 PM
Register now for the June 17th installment of the IMAPS Live Technical Webinar Series featuring a presentation from Laura Mirkarimi of Xperi entitled "Hybrid Bonding: Fueling Advanced Memory and High Performance Compute Roadmaps."
Location: Live Online Webinar via Webex