Event Registration - International Microelectronics Assembly & Packaging Society
International Conference on Device Packaging 2020
3/2/2020 - 3/5/2020

16th International Conference and Exhibition on
DEVICE PACKAGING

We-Ko-Pa Resort and Conference Center
Fountain Hills, Arizona USA
March 2-5, 2020


The largest 2020 conference dedicated to:

3D Integration 
Fan-Out, Wafer Level Packaging & Flip Chip
Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Gen Applications (new!)



♦ Visit www.imaps.org/devicepackaging for full event details. ♦


Location: WE-KO-PA RESORT & CONFERENCE CENTER, 10438 WEKOPA WAY, FORT MCDOWELL, AZ , AZ 85264


EARLY REGISTRATION DEADLINE: February 3, 2020