Calendar of Events - International Microelectronics Assembly & Packaging Society
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MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 23-24, 2022.

MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:

  • parallel technical sessions
  • an exhibition
  • additional  technical events

Grenoble – Europe’s conveniently located technology cluster for semiconductor research, design and manufacturing – easy access to Lyon (1 hour), Geneva (2 hours), Paris (3 hours by high speed train– TGV) airports.

more info...

The Centre for Power Electronics (CPE) Annual Conference at the University of Warwick, Coventry, UK on 5-6 July 2022 will bring together the Power Electronics, Machines and Drives Community to review the latest Research and Development that will impact the Electric Revolution. This Conference will feature Invited Keynotes and Presentations from Leading Academics and Industrialists, views of the Future Demands for Power Electronics and Drives and Opportunities for Pursuing a Career in this exciting field.

The Conference will be run over 2 days to provide a comprehensive review of status of Power Electronics Research and Development, including topics selected from:

  • Semiconductor and Passive Devices
  • Packaging and Interconnection
  • Converters and Drives
  • Control, Test and Reliability
  • Power Electronics and Drives Related Applications

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The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to acceler-ate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost-effective and reliable high-performance ceramic interconnect products for ex-treme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities. 

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International Conference and Exhibition on
High Temperature Electronics Network (HiTEN 2022)
July 18-20, 2022
St. Anne’s College in the University of Oxford
Oxford, United Kingdom

Abstracts Due:  March 2, 2022
Conference Chairs:
Colin Johnston
Oxford University
F. Patrick McCluskey
University of Maryland
HiTEN Conference Focus:
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics. HiTEN 2022 will include a new Invited Session on the eHarsh Project by Fraunhofer.
Abstracts are being requested in the following areas:
  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs
  • Memories
  • Passive components
  • Power devices
  • MEMS Devices
  • Sensors
  • Contacts and metallizations
  • Semiconductor materials
  • Materials
  • Packaging and interconnects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing

Those wishing to present and publish a paper at the HiTEN 2022 Conference must submit a ~500 word abstract electronically on/before MARCH 2, 2022, using the on-line submittal form at: All abstracts submitted should represent original, previously unpublished work.  All speakers are required to pay a reduced registration fee.  If your abstract is selected, you will be asked to follow the speaker timeline: - Speaker Acceptance Email (April 1, 2022); - Final Manuscript due for Proceedings (June 1, 2022); - Speaker Registration complete (June 1, 2022); - BIO Submitted (July 1, 2022); Slides/Presentation for session presentation (on/before July 17, 2022); and - Slides/Presentation file to distribute to registrants post-conference (on/before July 25, 2022).

The HiTEN Proceedings papers will be ARCHIVED into IMAPS online research portal/library, IMAPSource® - IMAPSource® currently features all of IMAPS proceedings, journal papers, magazines, and other conference publications back to 2010. This portal is a fully searchable, user and Google Scholar-friendly database.  The software allows for fully exportable citations, improved keyword and Boolean search functionality and customizable alerts, among many other features. The library is indexed by Google Scholar and many key scientific engines/indexes, and growing each day. Please visit  and search. HiTEC/HiTEN Proceedings can be found in our conference section:

Accepted papers may also be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. If you need assistance with the on-line submission form, please email

Students wishing to present at the HiTEN Conference must also submit a ~500 word abstract electronically and must check the “YES, I’m a full-time Student” button at the bottom of the submission page after you enter your abstract text in order to be considered for the student competition award.

more info...

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