International Microelectronics Assembly & Packaging Society

Event	Date	Time	Contact

Virtual Global Conference on Advanced System-in-Package (SiP) Technology A GLOBAL VIRTUAL CONFERENCE! August 9-12, 2021 The top global virtual event for Advanced System-in-Package technologies! Combining the 3D ASIP and IMAPS SiP events into an exciting, comprehensive program: One event covering SiP technology developments, solutions and business trends. ♦ Visit www.a dvancedsip.org for full event details. ♦ more info...	8/9/2021 -8/12/2021		IMAPS Staff

Indiana IMAPS Zoom Presentation The next Indiana IMAPS ZOOM presentation is Thursday August 19 at 3 PM Eastern Time. The topic is" The (Multi) Terawatt Challenge :Trajectories and Challenges to Decarbonizing Electricity Generation at Scale with Photovoltaics" by Nancy M. Haegel, Materials Science Center Director, National Renewable Energy Laboratory. Her presentation will include photovoltaic deployment generated electricity with its competitive conventional generation across the globe. It will also include focus on emerging technologies and continued innovation in solar energy. This promises to be an extremely informative presentation. A complete abstract and bio will follow shortly with all pertinent information to logon the ZOOM meeting. more info...	8/19/2021	3:30pm to 4:00pm	Larry Wallman

European Microelectronics and Packaging Conference (EMPC-2021) more info...	9/13/2021 -9/16/2021		Sweden Meetx AB