Calendar of Events - International Microelectronics Assembly & Packaging Society
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IMAPS-Hungary is happy to announce its online soldering contest for high school and university students. The contest will take place during the first quarter of 2022. Further information will be announced soon.

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Indiana IMAPS is planning its first 2022 Zoom meeting on February 10.
This afternoon meeting will feature a joint presentation by the University of Louisville and the University of Kentucky on their complimentary microelectronics research, engineering services and working with our industry.  Below is an overview of their facilities and capabilities.


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2/10/2022Time TBD

IMAPS-Czech and Slovak is happy to announce the AWOS conference in spring 2022. Further information will be announced shortly.

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Last call for abstracts. Exhibits/Sponsors almost sold out!

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7:00am to 12:00pmIMAPS HQ

Steering committee has decided to extend the call for abstract of MiNaPAD 2022 conference up to the 15th December 2021.


We are dealing you to contribute to this program and to share your technical knowledge to professional network in microelectronic packaging, assembly and interconnection.


MiNaPAD conference will lead on 10 & 11 March 2022 with physical presence at Grenoble.


MiNaPAD conference includes an exhibitor area (30 booths) and 2 days of conference.


If you are interested, please to send your abstract; on next month you will be informed about the session on which your subject will be.


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March 10 - 11, 2022

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