International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
IMAPS Workshop on Strategies to Revitalize the On-Shore Packaging and Assembly Defense Industrial Base

Event Type(s):
National Event

Description:
General Co-Chairs:
Jim Will, SkyWater Technology; Chris Riso, Booz Allen Hamilton Inc.
 
 
Speakers by Invitation Only – Program Details Soon
 
Overview:  The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve On-Shore Packaging and Assembly Capabilities on Monday, October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts. The mission of this workshop is to engage our workforce community to identify solutions, which address US Government and Defense requirements, critical to the onshoring of the microelectronic assembly and packaging supply chain. The workshop will feature a SHIP keynote speaker and SHIP program speakers, plus several breakout sessions with speakers focused on: Manufacturing, Assembly, Substrates & Materials, Enabling & Disruptive Technologies, Reliability, the Chiplet Ecosystem, and Workforce Development. 
 
All workshop attendees are invited to join the WELCOME RECEPTION for the IMAPS 2022 Symposium on Microelectronics at the conclusion of the workshop!

Event Date:
10/3/2022

Event Time:
8:00 AM - 5:30 PM Eastern

Location:


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10/3/2022