International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
IMAPS-Europe ESREF 2022

Event Type(s):
International Chapter or Partner Event

Description:

ESREF 2022, the 33rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, will take place in Berlin (Germany) from September 26-29, 2022 at the H4 Hotel Berlin Alexanderplatz.

This international symposium continues to focus on the newest developments and future prospects for quality and reliability management of materials, devices, and circuits for micro-, nano-, and optoelectronics. It provides a European forum for all aspects of reliability management and innovative analytical techniques for present and future electronic applications.

The conference will include the following tracks:

  • Assessment Techniques and Methods for Devices and Systems
  • Semiconductor and Nanoelectronics Technologies
  • Progress in Failure Analysis Methods
  • Microwave Devices and Circuits
  • Packaging and Assemblies
  • Power Devices and Systems
  • Photonics Devices
  • MEMS and Sensors
  • Extreme Environments and Radiation

Deadline for the four page abstract submission is March 20, 2022. Registration fees for presenting authors are expected to be about 650 euros. Authors must be present on site and give a presentation in person. Fees for regular participants will be 950 euros (on-site) or 500 euros (online). The aim is to have a face-to-face event. The online format is intended only as a fallback option.


Event Date:
9/26/2022 - 9/29/2022

Event Time:
TBD

Location:
H4 Hotel Berlin, Deutschland