International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
IMAPS-Germany EBL 2022

Event Type(s):
International Chapter or Partner Event

Description:

Intelligent design, intelligent manufacturing, testing and application will be the focus of the upcoming EBL conference, which will take place in Fellbach in June 2022. For this reason, the DVS calls for specialist lectures for the 11th DVS/GMM conference on electronic assemblies and printed circuit boards to be submitted now.

Terms such as “data mining”, “cloud solutions” or “artificial intelligence” have become indispensable in the age of digital transformation. Even in modern assembly technology, huge amounts of data are generated in this way. Whether in development and design, material procurement and storage, during production, quality control, sales and the user – the data volumes are recorded, collected and often processed in real time. But what happens to this data?

These and other questions will be answered at the 11th DVS/GMM Conference in the field of electronic assemblies and printed circuit boards.


Event Date:
6/14/2022 - 6/15/2022

Event Time:
TBD

Location:
Schwabenlandhalle, Fellbach