International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
IMAPS-Czech and Slovak AWOS

Event Type(s):
International Chapter or Partner Event

Description:
IMAPS-Czech and Slovak is happy to announce the AWOS conference in spring 2022. Further information will be announced shortly.

Event Date:
3/1/2022 - 5/31/2022

Event Time:
TBD

Location: