International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society
Event Name:
IMAPS-Czech and Slovak AWOS
Event Type(s):
International Chapter or Partner Event
Description:
IMAPS-Czech and Slovak is happy to announce the AWOS conference in spring 2022. Further information will be announced shortly.
Event Date:
3/1/2022 - 5/31/2022
Event Time:
TBD
Location:
Email Reminder: