International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
IMAPS-Japan ICEP 2022

Event Type(s):
International Chapter or Partner Event

Description:
Due to numerous requests, the abstract submission deadline
has been extended to December 8, 2021.
 
2022 International Conference on Electronics Packaging
ICEP 2022 will be a hybrid in-person/online event.
 
Date: May 11 - 14, 2022
Venue: Sapporo Community Plaza, Hokkaido, Japan
 
<<Technical Topics for Conference Papers>>
Advanced Packaging
Design, Modeling, and Reliability
Emerging Technologies
High-Speed, Wireless & Components
Thermal Management
Interconnections
Materials and Processes
Optoelectronics
Power Electronics
Other Upcoming Technologies
 
<<Abstract and Paper Submission>>
The abstract submission deadline is December 8, 2021.
Please submit your abstract using the template available at the
conference website.
 
Once an abstract has been accepted,
a final 2 pages paper in double column
format will be requested by the due date.
 
Accepted and presented papers will be published
in the conference proceedings and submitted to
IEEE Xplore as well as other Abstracting and
Indexing (A&I) databases (EI Compendex and INSPEC).
 
<<Session Style>>
We are planning to have On-site & On-line hybrid conference.
 
Regular Presentation Style:
Presentations will be carried out in two ways:
1)Real-time and 2) Pre-recorded.
 
On-line Poster Style:
Short presentation will be carried out in two ways:
1) Real time and 2) Prerecorded.
 
<<Contact>>
Secretariat of ICEP 2022
The Japan Institute of Electronics Packaging (JIEP)
E-mail: icep2022@jiep.or.jp
 

Event Date:
5/11/2022 - 5/14/2022

Event Time:
TBD

Location: