International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
IMAPS New England's 47th Symposium

Event Type(s):
Chapter Event

Description:

IMAPS New England's 47th Symposium

Virtual - via Zoom on April 15, 2021
10:00am - 12:30om EDST

Full Details and Registration 

There is No-Charge for Attending ... But,

Registration With a Valid E-Mail Address is Required!!!

Session D
"Advanced Packaging"
Session Chair
Richard Hollman

Program Summary
Technical Chairs: Michael Johnson, MACOM & Dave Saums, DS&A

"SiC Challenges and Uses in Electrification"
Frank Muscolino, Advanced Assembly Tech

“2.5D and 3D Integration Technology and Application”
Robert Patti, NHanced Semiconductors

“Uptake Capacity and Rate of H2Getters for Effectively RemovingOutgassed H2 Gas from Microelectronic Packages”
Hua Xia & David DeWire, Hermetic Solutions Group

                    9:45 AM        Check-In to ZOOM Meeting using e-mailed instructions
                      10:00 AM        Introduction - Michael Johnson and Dave Saums


Event Date:
4/15/2021

Event Time:
10:00 AM - 12:30 PM Eastern

Location:

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4/15/2021

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