March 2021 Semiconductor Industry Speaker Series Webinar
Wednesday, March 10, 2021
11:30 a.m. in Pacific Time (US & Canada)
An EDA Perspective: What’s the Difference Between
Heterogenous Integration and System in Package (SiP)
Cadence Design Systems
There is a new flavor of System in a Package (SiP) emerging as Moore’s Law slows. This presentation will help to explain this new SiP technology and how the term Heterogenous Integration is tightly coupled with it. This presentation will also outline some of the design and analysis challenges of these new chiplet-based architectures.
John Park brings over 35 years of design and EDA experience to his role as Product Management Group Director for Advanced Semiconductor Packaging at Cadence Design Systems. In this role, John leads a team responsible for defining cross-domain solutions and methodologies for IC, package & PCB co-design and analysis. Over the past three years, John has authored numerous publications on emerging trends in multi-chip(let) package design and analysis.
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IMAPS NorCal Chapter and MEPTEC Semiconductor Industry Speaker Series Webinar