International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
MEPTEC & IMAPS Semiconductor Speaker Series (WEBINAR)

Event Type(s):
Chapter Event

Semiconductor Industry Speaker Series - Carl Zweben - Advanced Thermal Management Materials and Low-Expansion PCBs
MEPTEC & IMAPS Semiconductor Speaker Series

Carl Zweben PhD
Advanced Thermal Materials and Composites Consultant​

Heat dissipation is an increasingly critical problem in all types of electronic and photonic applications. Other key design issues include thermal stresses, warpage, optical alignment, weight, size, cost, and manufacturing yield. Thermal stresses and warpage are primarily caused by differences in coefficients of thermal expansion (CTE). Semiconductors and ceramics used in packaging have low CTEs. Matching CTE can allow direct attach with hard solder, eliminating the high thermal resistances of most thermal interface materials. Decades-old traditional low-CTE materials like tungsten/copper, molybdenum/copper, Kovar, etc., all have thermal conductivities that are no better than that of aluminum (about 200 W/m-K). There are now many low-CTE, low-density advanced thermal management materials with much higher thermal conductivities - some as high as 1700 W/m-K, compared to 400 for copper. Some are cheaper than traditional materials. Weight savings as high as 85% have been demonstrated. The result is a significant and increasing number of production applications. Some of these materials are being used to reduce the CTE of printed circuit boards (PCBs).

This seminar first presents an overview of traditional thermal management materials and their limitations. We then discuss the key advanced thermal management materials and their properties, including low-CTE PCBs. Finally, we look at current microelectronic and photonic applications.

January 27, 2021 11:30 AM in Pacific Time (US and Canada)



Event Date:

Event Time:
11:30 AM - 1:00 PM Pacific


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