International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
MEPTEC & IMAPS Semiconductor Speaker Series (WEBINAR)

Event Type(s):
Chapter Event

Semiconductor Industry Speaker Series - Chiplet Technology for an Emerging Ecosystem
MEPTEC & IMAPS Semiconductor Speaker Series

David Kehlet

Chiplets, semiconductor devices designed for heterogeneous integration using a high bandwidth and low latency die-to-die interface such as the Advanced Interface Bus (AIB), provide opportunities to create advanced SoCs. At the same time chiplets create a need for security measures, higher bandwidth and protocols. In this talk Dave will describe chiplet security measures, the new AIB 2.0 interface specification, protocols suited for heterogeneous integration of chiplets, and outline chiplet standards and solutions.

.David Kehlet is a researcher at Intel working on pathfinding for FPGA technology including high speed interfaces. Currently David is focused on chiplets and interfaces to enable a new model of electronic system development. Earlier at Intel, David was Vice President of IP Engineering, developing communications protocols, signal processing, and memory interfaces on Intel's programmable logic devices. David and his team demonstrated Intel’s first HBM2 controller and the FPGA industry’s first 58Gbps transceiver. This year David has represented Intel regarding chiplet technologies to the US Government, to the IEEE Heterogeneous Integration Roadmap Committee, the Design Automation Conference 2020 Chiplet Integration Tutorial, the CHIPS Alliance 2020 Workshop, and to Intel customers and partners. David earned BS and MS Electrical Engineering degrees from Stanford University and holds 18 patents in the areas of computer graphics and video.

Nov 25, 2020 11:30 AM in Pacific Time (US and Canada)



Event Date:

Event Time:
11:30 AM - 1:00 PM Pacific


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