IMAPS Northern California Chapter Webinar | The Semiconductor Industry Speaker Series
Wednesday, November 11, 2020 / 11:30 am Pacific Time
Topic: Semiconductor Industry Speaker Series - Tim Orsley - Ribbon Alumina Laminate
MEPTEC & IMAPS Semiconductor Speaker Series
"Ribbon Alumina Laminate"
Because ceramic materials are inherently brittle, vias have traditionally been made in the green state prior to sintering. Since the sintering is done by the ceramics vendor (at very high temperature), the onus is upon them to fabricate the vias beforehand thus making the material custom and costly. This stands in stark contrast to PCB materials which are generic when delivered, customized instead by the PCB fabricator based upon their customer’s design. Through innovation, a new ribbon alumina laminate has been developed that allows for PCB processing, even mechanical drilling. The ribbon alumina can replace the traditional glass weave dielectric and, being homogenous, eliminate differential signal skew. The laminate supports very high speed signaling such as 5G with very low loss tangent and dielectric constant. Applicable both as PCB and package substrate, use for both dramatically reduces overall CTE mismatch while use as a package substrate better distributes stress. This presentation will consider the process flow of traditional ceramics in contrast with this new ribbon alumina laminate, and provide details on key laminate attributes.
Speaker: Tim Orsley
For the last twelve years, Tim Orsley has done business development for Corning from its technology center in the Bay Area. Prior to that he worked at Agilent/Avago (mice and image sensors) after spending decades in the storage industry (Iomega and Quantum) doing technical marketing and product planning. Tim holds bachelor degrees in Economics and Political Science from UCLA, as well as thirty-six U.S. patents.