International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
Virtual Conference - 17th International Device Packaging (DPC 2021)

Event Type(s):
National Event

Description:
Post Conference Registration extended to May 14, 2021.  

Event Date:
4/12/2021 - 5/14/2021

Location:
A Global Virtual Event
10438 N Fort McDowell Rd
UNITED STATES

Contact Person:
IMAPS HQ
(phone: 919-293-5000)


Event Registration:

Outlook/ vCalendar/ Google:
Click on the icon next to the date(s) to add to your calendar:
4/12/2021 - 5/14/2021