International Microelectronics Assembly & Packaging Society - Event Information - International Microelectronics Assembly & Packaging Society

Event Name:
17th International Conference and Exhibition on Device Packaging (DPC 2021)

Event Type(s):
National Event

Description:

Event Date:
3/1/2021 - 3/4/2021

Location:
WekoPa Resort
10438 N Fort McDowell Rd
Fountain Hills, AZ 85264
UNITED STATES

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Contact Person:


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3/1/2021 - 3/4/2021