There is No-Charge for Attending ... But,
Registration With a Valid E-Mail Address is Required!!!
Technical Chairs: Michael Johnson, MACOM & Dave Saums, DS&A
"SiC Challenges and Uses in Electrification"
Frank Muscolino, Advanced Assembly Tech
“2.5D and 3D Integration Technology and Application”
Robert Patti, NHanced Semiconductors
“Uptake Capacity and Rate of H2Getters for Effectively RemovingOutgassed H2 Gas from Microelectronic Packages”
Hua Xia & David DeWire, Hermetic Solutions Group
9:45 AM Check-In to ZOOM Meeting using e-mailed instructions
10:00 AM Introduction - Michael Johnson and Dave Saums