International Microelectronics Assembly & Packaging Society - Event Information


Event Name:17th International Conference and Exhibition on Device Packaging (DPC 2021)
Event Type(s):National Event
Description:
Event Date:3/1/2021 - 3/4/2021
Location:WekoPa Resort
10438 N Fort McDowell Rd
Fountain Hills, AZ 85264
UNITED STATES

click here for Google Maps
click here for Mapquest
Contact Person:Brianne Lamm
Links:https://imaps.org/photos/62160_04302020135526.jpg
Outlook/vCalendar/Google:Click on the icon next to the date(s) to add to your calendar:
3/1/2021 - 3/4/2021
Email Reminder:click here to setup an email reminder for this event


return to International Microelectronics Assembly & Packaging Society